30 October 2017 | The future of manufacturing-led development

DOWNLOAD EVENT REPORT

With increasing use of advanced digital technologies in manufacturing, such as 3D printing, robots and cloud computing, the landscape of technology and globalisation patterns is altering. As manufacturing becomes more automated, the criteria of being an attractive production location changes from offering inexpensive labour to lower capital costs and more advanced technology. This suggests that the economic progress in developing countries, who often rely on their comparative advantage in labour-intensive manufacturing, may be at risk.

To discuss how developing countries can adapt to the changing nature of globalisation, this World Bank, DFID, ODI/SET event will hear from Anabel González, Senior Director and Mary Hallward-Driemeier, Senior Economic Advisor in the Trade and Competitiveness Global Practice at the World Bank. The World Bank’s recent report, ‘Trouble in the Making? The Future of Manufacturing-Led Development’ suggests that while emerging technologies may threaten manufacturing as a pathway for low-income countries to develop, it can also present new opportunities given appropriate policy actions. The report explores policy agenda based on three dimensions; competitiveness, capabilities and connectedness.

For further information or to express your interest in attending this event, please contact Karishma Banga at ODI (k.banga@odi.org.uk).

 

Speakers

His Excellency Dr Hailemichael Aberra Afework – Ethiopian Ambassador to the UK

Dirk Willem te Velde – Principal Research Fellow, ODI and Director, SET

Anabel González – Senior Director, Trade and Competitiveness Global Practice at World Bank

Mary Hallward-Driemeier – Senior Economic Advisor, Trade and Competitiveness at World Bank

Nick Lea – Deputy Chief Economist, DFID

Karishma Banga – Researcher, ODI

Simon Maxwell – Senior Associate and former Director, ODI

Jonathan Rosenthal – Africa editor, The Economist

 

Photo credit: © Dominic Chavez/World Bank. License: CC BY-NC-ND 2.0.